10.00am

Expo Opens

10.30am

Challenges in PCBA Cleaning & Coatings
Eren Argun, Territory Manager- ONBoard Solutions

In the drive for smaller, more densely populated PCBAs, the margin for error in environmental protection has vanished. While many manufacturers view cleaning and conformal coating as independent steps, the reality is that they are two halves of a single reliability equation. Applying world-class coating over "no clean" residues is a recipe for delamination, osmotic blistering, and electrochemical migration. In this session, we explore the technical synergy between surface energy and coating adhesion. We will discuss why surface preparation is the most critical variable in coating success and how to navigate the transition from traditional methods

11.30am

Affordable Yet Versatile Multifunction 12 in 1 Test & Measurement Devices for Everyone 
Kendrick Tan, Regional Sales Manager APAC – Digilent Inc

Digilent, now a part of Emerson, has been at the forefront of innovation since 2000, crafting hardware and software solutions that empower engineers, researchers, educators, and scientists to design and test with unparalleled flexibility. Our customizable solutions cater to both seasoned professionals and emerging engineers, accelerating development while maintaining a low barrier to entry.
Specializing in USB-based test and measurement devices, flexible and intuitive software, low-cost data acquisition and data logging tools, and AMD-based FPGA development boards, our products’ design philosophy champions your creativity.

12.15pm

Advancing Physical AI
Dr. Joe Peng, Sr. Regional Sales Manager – ANZ – AMD

Physical AI systems—with their need to sense, understand, and act within the real world—face unique design challenges in performance, power efficiency, latency, and system integration. This session explores how AMD’s latest technologies enable engineers and solution designers to overcome these obstacles and accelerate real-world AI deployment. We will introduce how AMD x86 APUs deliver high-efficiency CPU + iGPU + NPU compute for edge AI, and how AMD Adaptive SoC/ FPGA platforms provide deterministic, low-latency acceleration for robotics, automation, industrial vision, smart surveillance, and embedded intelligence. Attendees will learn practical design approaches, architectural considerations, and examples of hybrid APU + Adaptive SoC deployments. The session will highlight how AMD’s unified toolchains, AI software ecosystem, and long-life embedded product roadmap support the rapidly growing need for reliable, scalable Physical AI solutions.

1.15pm

Transforming Test with AI: Introducing NI Nigel™ AI and LabVIEW+ Suite
Erfan Khordad, Field Applications Engineer- Braemac

Discover how AI can help you drive productivity gains, unlock deeper insights with advanced data analysis, and elevate product quality to unprecedented levels. Come see the latest features in this significant release of the LabVIEW+ Suite - the most productive AI-enabled test and measurement toolchain. With LabVIEW at the heart of the suite, Nigel AI can play an authorship role on the block diagram to speed up your coding. The build includes numerous improvements to the debugging workflow, UI development, and more.
Development teams also get enhanced containerization capabilities, with docker containers for Windows. Come join the session to check out the interactive live demo as well!

2.15pm

Design for Manufacturing Masterclass
Scott Williams, Head of Engineering – Xentronics

A deep dive into Design for Manufacturing in the electronics industry. This discussion starts with the foundations and principles of what Design for Manufacturing (DFM) is and really means, leading into understanding of the different areas (DFA, DFT, DFF, etc.), a framework for designers on when they should - and shouldn't - care about DFM in areas of their design, and finally 40+ specialised tips on designing electronics and PCBs for real manufacturability.

3.15pm

Building Robots in the Age of AI
Ian Saturley, Associate Director Marketing & Michael Reznik, Staff Field Applications Engineer - Microchip Technology Inc.

As robotics and embedded intelligence move rapidly toward more autonomous, perceptive, and connected systems, developers face increasing demands for faster innovation and more integrated toolchains. This seminar will showcase how Microchip’s latest AI driven software tools address these emerging needs and accelerate the development of next generation embedded solutions and robots.
Apart from highlighting Microchip’s evolving support for Zephyr RTOS and ROS 2 (Robot Operating System), the session will dive into the key building blocks for robotics including ML image processing on the edge, Sensor Fusion – Bridge to GPU engine, , advanced wired and wireless network interconnect solutions, and motor control reference designs that empowers robot speak movements and “humanoid arm”.

4.15pm

Reimagining Electronics Creation in a Software-Defined World
Ken Kozak, Head of APAC – Altium

Electronics development globally is facing growing complexity, tighter timelines, and more distributed teams. This session explores key industry trends including cloud collaboration, connected design data, and the integration of ECAD, MCAD, and systems engineering.
The session focuses on real-world trends and practical ways to improve design processes, including how modern, connected design environments—such as the evolving Altium platform—are enabling more efficient, integrated development.

6.00pm

Expo Closes

9.00am

Expo Opens

9.45am

Precautions for SDR Series Products Manufacturing
Hanward Jiang - General Manager - Shenzhen Cirket Electronics Co.

Shenzhen Cirket is one of the main Hackrf One manufacturers in China. We are going to share our producing and usage experience for Software-Defined Radio, include Lime SDR, KrakenSDR, Raspberry Pi, Portapack H4, ESP32 DIV, Pixhawk and RF433 MHZ. There are numbers of suggestions and feedback from our end customers will be represented and discussed in this session.

10.30am

Power Integrity Measurement Fundamentals
David Ore, Application Engineer - Rohde & Schwarz

Clean and stable power rail voltages are the basis for proper performance of any electronic design. The demand for higher performance, higher level of integration and lower power consumption is driving down supply voltages, making tolerances tighter and power rail qualification more challenging. Oscilloscopes play a key role in evaluating the performance of power rails. In this session, we will compare different measurement techniques for power rail analysis and highlight the advantages of specialised power rail probes..

11.30am

Reimagining Electronics Creation in a Software-Defined World
Ken Kozak, Head of APAC – Altium

Electronics development globally is facing growing complexity, tighter timelines, and more distributed teams. This session explores key industry trends including cloud collaboration, connected design data, and the integration of ECAD, MCAD, and systems engineering.
The session focuses on real-world trends and practical ways to improve design processes, including how modern, connected design environments—such as the evolving Altium platform—are enabling more efficient, integrated development.

12.30pm

From Global Volatility to Local Manufacturing Certainty: Securing the Australian Electronics Supply Chain
Morten Soeresen, General Manager - Braemac Edge Computing with AMD

As geopolitical shifts continue to disrupt traditional supply routes, Australian manufacturers are seeking more than just a component supplier - they need a strategic partner.
This session breaks down the current global complexities impacting local production and introduces a more robust model for operational stability.
We will explore how Braemac’s unique, "end-to-end" integration—combining
global procurement scale with local design and assembly services—enables businesses to de-risk their entire product lifecycle. Attendees will learn how to leverage this combined expertise to bridge the gap between initial design and final production, ensuring that local manufacturing remains agile, cost-effective, and shielded from global headwinds.

1.30pm

Technology IoT Beyond Cellular Coverage - 3GPP NTN
Dong Hui / Wendell Boyd, Technical Sales - Nordic Semiconductor

Non-Terrestrial Networks (NTN) were formally introduced in 3GPP Release 17 in 2022, to extend existing cellular technologies such as NB-IoT to satellite communications. Compared with proprietary satellite IoT technologies, 3GPP NTN offers key advantages in interoperability, roaming capability and long-term roadmap stability.
From a hardware perspective, cellular chipset and module vendors are already offering solutions that enable this technology. On the network side, multiple operators and satellite partners are deploying commercial services based on the same 3GPP standard.

2.30pm

Building Building Robots in the Age of AI
Ian Saturley, Associate Director Marketing & Michael Reznik, Staff Field Applications Engineer - Microchip Technology Inc.

As robotics and embedded intelligence move rapidly toward more autonomous, perceptive, and connected systems, developers face increasing demands for faster innovation and more integrated toolchains. This seminar will showcase how Microchip’s latest AI driven software tools address these emerging needs and accelerate the development of next generation embedded solutions and robots.
Apart from highlighting Microchip’s evolving support for Zephyr RTOS and ROS 2 (Robot Operating System), the session will dive into the key building blocks for robotics including ML image processing on the edge, Sensor Fusion – Bridge to GPU engine, , advanced wired and wireless network interconnect solutions, and motor control reference designs that empowers robot speak movements and “humanoid arm”.

4.00pm

Expo Closes

Programme may be subject to change